Electronics Forum: osp bga substrate (Page 1 of 18)

bga warp

Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske

Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef

What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board

Plastic BGA mounted on Alumina substrate

Electronics Forum | Wed Jun 25 03:49:17 EDT 2003 | M.DAttilio

Hello everyone, my company produce Alumina PCB. Till now we mount ceramic BGA on alumina substrate, but now it's hard to find ceramic components so we'd like to mount plastic BGA on this kind of substrate. Do you know problems about it? Please, if yo

Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song

Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song

Re: Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon

| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 17:58:44 EST 1999 | Dave F

Dave: You should see a solder smudge on the gold plating where the ball was attached, if there is (was) solder reflow during either the (1) BGA fabrication, (2) your BGA attach, and / or (3) your BGA removal. You rework will not remove the solder

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.

Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

What is the typical BGA substrate pad alloy

Electronics Forum | Thu Dec 02 09:20:33 EST 1999 | Dave Cunningham

Is there a typical alloy used by vendors on the substrate pad? What is their process used to attach a eutectic ball to that pad? Thanks.

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup

Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or

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