Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Fri Sep 12 17:58:30 EDT 2008 | robinj
Can someone let me know what is causing this black coloration around the pads? It is on the edge of all pads all over the board. The surface finish is OSP. I don't have any solderability issue. But the stencil printer is having trouble with picking u
Electronics Forum | Wed Jan 04 07:32:35 EST 2017 | pavel_murtishev
Good day, Having recieved new batch of PCBs with OSP surface finish, I have noticed that some polygons not covered by solder mask and solder paste become darker after second reflow cycle compared to PCBs not being sent to reflow. I wonder whether i
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Mon Aug 28 17:04:52 EDT 2006 | Board House
ImSn - Immersion Tin - Not Recomended- short shelf life ImAg - Immersion Silver - Prefered Surface finsh by most Board houses, Best reworkablility, 12 moth self life, ENIG - Electroless Nickel Immersion Gold - Second Choice for Board Shops, 12 -
Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory
| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave
Electronics Forum | Fri Jun 18 17:19:48 EDT 1999 | Jason Gregory
| | | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rav
Electronics Forum | Fri Jun 18 14:19:29 EDT 1999 | Earl Moon
| | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave re
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
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