Electronics Forum: other ip/qp 32mm (Page 1 of 2)

voids at solder joint of chips

Electronics Forum | Fri Aug 10 04:19:05 EDT 2001 | wister

There are lots of voids at solder joint of chips,the thickness of multilayer pcb is 3.2mm,top side have lots of chip component and bottom side has several BGA and QFPs.For top side profile,the preheat time is about 100s,soak time is about 75s,time ov

CP45 Camera resolutions

Electronics Forum | Thu Jan 04 22:40:08 EST 2024 | erikfriesen

Does anyone know what the meaning of the Fixed vision options here https://file.yizimg.com/397047/2014010615545616.pdf showing two checkboxes, one 32mm, the other 17mm? The issue at hand is that fixed camera(upward facing) resolution really to low t

SMT hand soldering on HASL or Ni-Au boards?

Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin

Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better

Re: What do you expect to hear?

Electronics Forum | Wed Jul 08 09:05:09 EDT 1998 | Jon Medernach

Going to SMT from THT you will find a tremendous difference in machine reliability. All the chip shooters are 99.9+%. Fuji has the largest market share in the US so you will hear alot about Fuji. In the Far East the Create chipshooter by Panasonic

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Re: 15G PQFP

Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon

| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part

15G PQFP

Electronics Forum | Mon Jun 01 17:41:59 EDT 1998 | Jim Hoxie

First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part. T

Re: 15G PQFP

Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach

I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad

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