Electronics Forum | Wed Nov 20 01:38:53 EST 2019 | ajspec
Hi, i'm facing solder mask peel off but limited to the solder defined pad only(opening area). no peel off on the other area and it happened on electroless nickel immersion gold finishing only. for other finishing is not affected. kindly advise if you
Electronics Forum | Wed Oct 16 11:51:03 EDT 2002 | Brian W.
Pink Lady refers to solder stop, or temporary solder mask. There are a couple of types. Peelable, which you must peel off after processing, before wash, and of course before you ship. There is also a water soluble version, which dissolves in the w
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Tue Oct 10 13:32:26 EDT 2006 | rsteele
Does anyone know of any tests or testing done on the peel strength of components to pads. I have alot of info on FAB level peel strength testing, but nothing on components themselves. Is there any process(es) to test and insure new pastes and reflo
Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob
Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard
Electronics Forum | Fri May 23 23:58:48 EDT 2014 | edriansyah
Hi Hege. I was not also too confident with the black pad (coz no black residue on the remaining pad). But based on my search on the internet regarding black pad. Most of them shows a very clean BGA Pad after peel off the BGA as the picture reference
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe
Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s
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