Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Tue Mar 25 14:27:16 EDT 2008 | smtnet51
Make sure whatever you are using for a fid. is apart from any other pads or apertures. It'll grab a pad/aperture above or below (in auto mode) and screw up your print. We saw this alot when using pads for fids on DEKs.
Electronics Forum | Mon Mar 24 15:54:36 EDT 2008 | Paul M.
What r u using for fiducials ? fids? pads? thru-holes? video model? What r u using to print the paste? squeege blades? proflow? paste puck? Why r u using Step Mode ?
Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson
Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe
Electronics Forum | Tue Dec 23 14:45:06 EST 2008 | comatose
One thing that helps is to divide large pads into a series of smaller pads. This prevents the scooping you're talking about.
Electronics Forum | Wed Dec 24 20:11:43 EST 2008 | xianhua_tang
hi,brettc! Our stencil openings no more than 4mm * 4mm, you have a larger component of the pads is more than a 4*4? At the same time, with the thickness of the stencil, I would like to increase the printing speed can be improved to reduce the thickne
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
