Electronics Forum | Sat Jul 13 09:00:44 EDT 2002 | davef
One of those pick your poison things, eh? * Reduce tester time and labor versus not testing the board after seperation from the panel * Traces that connected to the common bus will have exposed copper after seperation from the panel. This is not rec
Electronics Forum | Thu Jul 27 14:24:10 EDT 2000 | Alan Aben
We are currently working with a ceramic substate boards that come as a eight up panel with a coupon around the edge. I am looking for tooling that can be used to seperate the finished boards out of the panel
Electronics Forum | Mon Apr 17 22:56:10 EDT 2006 | davef
Have you considered singulation? It uses a press and a peculiar die to seperate the useful cicuit from the panel. Suppliers include: * Wand 847-459-2400 F2421 * Circuit Technology 708-705-2140 f2141 John Bambule * Pioneer - Dietecs 781-682-7900 F03
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Mon Aug 18 12:02:18 EDT 2003 | russ
It all dependes on the de-paneling method. V-score - .100" is probably to thick for manual seperation. There are machines that I believe can cut through a V-Score up to .125" or greater Breakaway tabs - .100" is getting to the limit when doing t
Electronics Forum | Wed May 04 09:37:08 EDT 2005 | MikeaJ
I would not recommend trying to cram or mix and match multiple images on a stencil. Especially if you are a contract house, and your clients don't understand why sending one board seperate from a panel of four is a pain in the face. However, I have h
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Thu Apr 14 22:11:42 EDT 2016 | davef
Enough pluses and minuses to get things started are: * Mouse bites (+) boards can be irregularly shaped, no board redesign (-) no one knows how to seperate the things, requires layout consideration * Singulation (+) boards can be irregularly shaped (
Electronics Forum | Wed Dec 22 12:21:51 EST 1999 | Dave F
Jake: This'll get you started: 1 Read the archives 2 primary approaches to paneling are; * Moise bites * Singulation * Routing * Scoring * Shearing 3 Major depaneling technologies are: * Singulation (Wand 708.459.2400fax2421, Circuit Technolo
Electronics Forum | Sun Dec 25 18:54:04 EST 2005 | mariss
We are experiencing fracture problems with 0805 X7R capacitors. The capacitors seem to fail in tension; during hot-air rework they come apart in two pieces with the fracture near the metallization end. Only X7R SMT components are affected, C0G and Y
