Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Mon Jan 19 09:49:20 EST 2004 | davef
Not as such. Choices are: 1 Cut and epoxy some board foil from your board fabricator. 2 Sacrifice part a pad repair kits from the likes of: * Engineering Lab 905-785-1982 * Circuit Technology Center 978-374-5000 * General assembly suppliers catalog
Electronics Forum | Wed Aug 07 17:20:17 EDT 2019 | orbitcoms
The aperture over the pads is set to 95% coverage of the pad. The stencil is 0.12 mm thick.
Electronics Forum | Thu Aug 08 13:05:45 EDT 2019 | horchak
What is your pad width? What is lead width? Is the part gang masked, or has masking between the pads? Pads plated or HASL, if HASL how thick? What is board thickness and size? Does it need to be fixtured for support thru out the process. Semi auto sc
Electronics Forum | Wed Aug 07 12:41:58 EDT 2019 | slthomas
Are the apertures on the stencil reduced in width or 1:1 with the pads? It depends on the pad width and foil thickness but we usually reduce aperture width for any part that results in an aperture wall spacing of less than 8.5 mils.
Electronics Forum | Wed Aug 07 17:55:33 EDT 2019 | slthomas
You should be well within area and aspect ration guidelines with that. Are you printing and placing close to center on the pads? Sometimes operators will "bump" the parts to center them on the pads if they're not placed correctly, and if they've bee
Electronics Forum | Wed Aug 07 18:25:52 EDT 2019 | slthomas
Normally if the package is defined properly I would expect your machine to place it correctly but we have some parts pushed right down to the pads. If the paste is centered, and the parts are centered, and you have obvious bridging potential coming
Electronics Forum | Wed Aug 07 18:00:56 EDT 2019 | orbitcoms
I am doing another run today. I'll check how central the machine is placing the components onto the pads. I wonder if the part is off slightly and smudges past across the pins? What about if the part is being placed too deep into the paste?
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