Electronics Forum | Thu Nov 19 03:52:35 EST 2020 | dharmesh294
Thanks Bill Axler, Please send me on dharmendra.patel@slscorp.com.
Electronics Forum | Fri Oct 22 17:15:58 EDT 1999 | Parvez Patel
Hi, I am trying to locate any vendor who can supply me some 28 mil * 28 mil matrix tray feeders for test component storage Thanks Parvez Patel SMT Lab UIC - Binghamton - New York
Electronics Forum | Wed May 26 14:14:17 EDT 1999 | Parvez Patel
hello all, I was just wondering, Is it true, that for a given package (area array), upto a certain limit, the assembly reliability improves with decreasing land pad diameters? Thankx in advance Parvez Patel Graduate REseacrh Associate SUNY-Binghamt
Electronics Forum | Wed Mar 13 10:53:58 EDT 2013 | emeto
Patel, I don't think you can change the camera view as it is not moving, neither the board does. Emil
Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez
hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr
Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel
Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo
Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F
| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
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