Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF
Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi
Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko
Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Thu Mar 14 09:07:26 EST 2002 | cfraser
I can not tell you what the actual stress limits are. I can tell you that de-paneling PCB's by hand is a very poor choice. I have seen numerous accounts of cracked caps, resistors, and LED�s due to incorrect de-paneling procedures. I would recommend
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