Electronics Forum | Fri Oct 01 09:45:53 EDT 1999 | Andrew W. Dalrymple
| We are looking for a midwest board design house - Mike Weekes - 630 595 2300 x292 or email me at mweekes@phoenixofchicago.com | | I am starting up a PWB Design Service Company. We are Currently in Dallas. My partner and I have 25 years experia
Electronics Forum | Mon Feb 29 23:41:09 EST 2016 | padawanlinuxero
Is more a guess but, your drawing is missing things, more precise the legends on the edge of the drawing, but for what I can see the diameter of the ball is 0.30 +- 0.05 hope it helps!
Electronics Forum | Tue Feb 23 04:54:54 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Fri Sep 24 15:56:45 EDT 1999 | Michael Weekes
We are looking for a midwest board design house - Mike Weekes - 630 595 2300 x292 or email me at mweekes@phoenixofchicago.com
Electronics Forum | Fri Oct 01 15:08:49 EDT 1999 | Dave F
| We are looking for a midwest board design house - Mike Weekes - 630 595 2300 x292 or email me at mweekes@phoenixofchicago.com | | Michael: Try:
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Fri Aug 13 05:38:45 EDT 1999 | stefano bolleri
Ray, what about allowing everybody else to know about the "more info" ???? This is supposed to be a forum, isn't it? Bye, SB | Thanks for the reply, | i have sent you an e mail with more info in it. | thanks ray hare
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
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