Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina
I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/
Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina
I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/
Electronics Forum | Wed Oct 09 11:59:56 EDT 2002 | slthomas
Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particularly one that focuses on different processes? I'm being asked to produce information from said
Electronics Forum | Wed Oct 09 14:15:56 EDT 2002 | slthomas
Pardon the cross-post from the design board....I thought maybe I should query both populations. Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particu
Electronics Forum | Sun Jan 16 01:12:24 EST 2011 | leo83
Manual Picking of PCB -> Manual Placing into oven OR The procedure after Pick and place should be Completely Automatic ? Rgrds, leo
Electronics Forum | Thu Sep 15 22:23:36 EDT 2005 | davef
Use your board supplier recommendations Specific procedure or guidelines that need to be followed for handling Moisture Sensitive Devices => J-STD-020 & J-STD-033 Is there any paste height/volume requirement for a lead-free process? => You need to
Electronics Forum | Fri Sep 02 05:17:54 EDT 2005 | pyramus
I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts? Is there any paste h
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
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