Electronics Forum: pcb mill component pocket (Page 1 of 2)

2010&2512 cracking

Electronics Forum | Tue Feb 23 10:33:40 EST 2010 | andrzej

To prevent cracking SMD components near the edge of PCB you should use guillotine for V-cut groove. Other solution is redesign panel of PCBs and in critical areas you should mill along the outline instead of V-cut, but if you choose this way probabl

Re: screen printing adhesives

Electronics Forum | Wed Aug 25 19:31:22 EDT 1999 | Dave F

| JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH. | Chad: You don't need to YELL!!! Anyhow, yes we ha

PTH lead milling

Electronics Forum | Fri Feb 15 07:52:27 EST 2008 | lococost

Dear SMTnetters, I've been told to have a look at finding a machine that could mill the leads of all PTH components to a certain height on an assembeled and soldered PCB. PCBs should be inserted in one side of the machine and come out milled on the

Flex PCB through production

Electronics Forum | Sat Oct 19 03:53:18 EDT 2019 | robl

For volume we used machined pocket durastone pallets, machined to the thickness of the flex to allow flat printing, with pockets machined for components placed on side 1. We held them down with 3M spray mount. For low volumes we used flat durastone

2-sided BGA

Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef

Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature

Re: PCB Support

Electronics Forum | Tue Nov 30 17:04:34 EST 1999 | Dave F

Continuing, many soldering pallet manufacturers make pallets with pockets to support bottom-side components during second side processing. Good luck Dave F

Solder Coverage in Non ROHS Paste

Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr

Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem

Bump printing with solder paste

Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc

Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa

AP 25Hie

Electronics Forum | Tue Jan 13 19:16:03 EST 2004 | pjc

Dedicated tooling uses what MPM calls an "H" tower. You mount the board support plate (dedicated tooling) on top of the H tower. If boards are only single-sided SMT, meaning only components on one side, the board support plate is flat with vacuum hol

Yamaha P&P machine model compare

Electronics Forum | Tue May 17 03:48:51 EDT 2005 | Base

YV100, easy... YV112 uses a dual work-area, dual gantry machine in which the gantry does X and the PCB-table does Y movements. Also each gantry can only work on one PCB work-area and can pick form only one side of the machine. Basically you have two

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