Electronics Forum | Thu Aug 25 23:10:55 EDT 2016 | kib45128
MT professional foundries: SMT, DIP, assembly, testing, packaging and "professional OEM services SMT processing, SMT placement, SMT proofing, SMT pilot, DIP semi-finished products, OEM / Sample proofing, the whole process of professional Sample trial
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Fri Jul 30 11:32:31 EDT 2004 | westred
I am looking for a fool-proof way to have operators measure PCB's out of the depaneler to ensure that the tolerances for the outside edges are being met. Probably a spot check system to make sure the process is in tolerance. So far building a "GO"
Electronics Forum | Tue Jun 05 14:04:11 EDT 2007 | hussman
We have the same situation here. But generally it is the customer gives us a 1-up Gerber drawing and we need a multi-up or some form of breakaway to make the product. The way we achieve this is thru a Word document we call PCB Guidelines. We attac
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
Electronics Forum | Sat Jan 09 12:31:42 EST 1999 | Steve Joy
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Fri Mar 26 11:48:45 EST 2004 | patrickbruneel
I know it is not easy to quantify zero. The biggest dilemma the no-residue technology is facing "disbelieve" The most accurate proof to the fact that all solids disapear under heat is TGA analysis. Test the no-residue in your facility under the rig
Electronics Forum | Mon Oct 17 13:19:25 EDT 2005 | moonshine
Visit Proof Of Design's website and download free documentation, including MSD, ESD, and so much more, covering almost everything PCB and PCBA/SMT. http://www.moonmanondarkside.com. Earl Moon MoonMan
Electronics Forum | Thu Jan 30 17:29:30 EST 2020 | stephendo
Even if it is no where near the pumps it is probably certified explosion proof. Could they have had aluminum sheets, painted them, cured them, stenciled conductive traces, cured it, stenciled conductive adhesive, populated parts, cured it then singu
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