Electronics Forum | Sun Mar 03 22:15:13 EST 2002 | caldon
RPS (Robtic Process Systems - I think) Makes a system called a Wet Balance tester. This machine is useful for Solderability on PCB sections and Components. Also for more info please go to http://www.empf.org/html/empfset.htm and down load Decemeber
Electronics Forum | Mon Apr 15 12:22:21 EDT 2019 | cyber_wolf
You demonstrate it and record it by the report. The report contains the check off items that you defined in the protocol along with supporting data from the testing you did. This usually involves part numbers,data points, and photos. The report shou
Electronics Forum | Wed Nov 06 08:59:51 EST 2002 | rmorford
This defect is there after reflow. My first thought was that the boards had some sort of contamination, too. This is a new PCB manufacturer for this board (they have been making other boards for us). But... why only on the connectors -- why only o
Electronics Forum | Sat Dec 24 08:26:41 EST 2005 | GS
Thank you, very intersting. Seen they've experimented also Sn Cu Ni on wave solder. Rgards............GS
Electronics Forum | Fri Dec 23 23:29:17 EST 2005 | azbvc
Slaine, thank you for sharing..
Electronics Forum | Fri Dec 23 06:09:04 EST 2005 | Slaine
good report showing lots of sections and compairng differnet pcb finishes http://www.smartgroup.org/experience/experience%20report%202005.pdf
Electronics Forum | Mon Aug 22 15:57:28 EDT 2005 | pr
Is there a test to check for delamination on a pcb? We are looking at new board houses and along with our standard solderability tests my boss wants to test for delamination. thanks, pr
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
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