Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Mon Oct 02 10:25:49 EDT 2006 | SWAG
Daxman, Try this: - it might help your histogram. The camera may be operating production reads at or close to the z-axis drive limit but you don't know really. Write a dummy program that will allow you to load a PCB into the centernest at vision h
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K
Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with
Electronics Forum | Wed Jun 21 09:21:37 EDT 2006 | don dawson
I've been building boards for a long time and have never heard of anyone using electrolytic silver. Immersion silver would be 8-18 microinches thick. Plated silver would be significantly thicker (min a couple tenths - .0002" and up). So you may be ab
Electronics Forum | Mon Jan 09 11:34:40 EST 2023 | tommy_magyar
How big is the board? What is the thickness? How populated is it? Is it warping in the reflow oven? If yes, does the oven have any support? How big is the pad compared to the component footprint? How thick is the stencil? Are the components checked b
Electronics Forum | Wed Jun 02 09:50:00 EDT 1999 | Earl Moon
| Hello all | I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with
Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo
Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so
Electronics Forum | Fri May 17 14:46:29 EDT 2002 | Claude_Couture
in both samples the water displacement is 1 cubic inch of water since the volume is the same. the first has a thickness of 1 inch, the second has a thickness of a few microns. if you know the volume and one of the lengh, width or thickness, you can c
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