Electronics Forum: pcba analyser 160 (Page 1 of 1)

Find PCBA failure analysing service in Asia

Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen

Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,

Phoenix PCB X-RAY - VOIDING SOFTWARE

Electronics Forum | Sat Mar 13 13:34:45 EST 2021 | proy

I have an excellent operating X-Ray - Phoenix PCB analyser 160. It seems there was available software for Voiding Calculation but I am not sure if my machine has this - I do know that we have the BGA analysis tool, but have to look in and see if we

Phoenix PCBA XRAY tube service help.

Electronics Forum | Thu Sep 22 10:04:33 EDT 2022 | micropak

Good Morning, I have a Phoenix PCBA Analyzer 160KV with NanoFocus tube. The machine warms up till 104KV only (it gets some breakdowns around 100KV) and then it finishes warmup but doesn't go beyond 103KV while doing inspections. HTG Cable has been gr

Auto mold machine

Electronics Forum | Mon Feb 08 20:18:39 EST 2010 | city4497s

Hi I'm looking for a auto mold machine for PCBA application in singapore, anyone have any recommendation. My PCB size is 160mmX42mmX0.6mm, the units are arrange in array form and there are about 12 ~ 20 unit per strip. the mold size is about 15mmX5m

Re: BGA problem: open after reflow

Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000

>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with

Nordson Dage XD7600NT vs Nikon XTV160

Electronics Forum | Thu Apr 03 17:50:53 EDT 2014 | rboguski

We use it almost exclusively in manual mode for PCBA failure analysis. Our main purpose is to find head-in-pillow defects; secondarily incomplete wetting of ball to substrate. In two years of almost continuous use we have only had occasion to use t

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