Electronics Forum | Fri Jul 06 10:35:32 EDT 2012 | ashworth14
All i used to do was blow them with an airline to remove the excess moisture then bake them for 15/20 min at 100' in an oven and that seems to work fine, i did get the info from a 4 stage cleaning guide for the actual cleaning solution we used but it
Electronics Forum | Wed Jan 12 20:18:14 EST 2011 | Jacki
How many % were affected? If a few,it can be caused bcoz of PCB coating. We had encountered it and PCB house replaced for faulty boards. Since then, we do test first if we hve to solder PCBs from this PCB house.
Electronics Forum | Wed Apr 17 15:31:25 EDT 2019 | noyart
At the company that I work at we have used rehm ovens and been very happy with the results. The one we have now has 8 zones with 2 to 4 cooling zones. I can check tomorrow what oven it is. The company produce a lot of different batches of PCBS, from
Electronics Forum | Tue Mar 26 07:42:32 EDT 2019 | kylehunter
Hello all, My company specializes in pcb design and subsequent prototype assembly. With that core of business, we will assemble up to 10 boards a week. We currently hand solder and use a reflow hotplate for these boards. We have been getting reques
Electronics Forum | Mon Mar 20 22:08:24 EDT 2023 | tey422
For reflow oven to "auto off" it has to go through the cool down; it should be off went the cool off temperature is reached. Perhaps you need to 1st check if something prevent the oven reach the cool off temp (both hardware & software).
Electronics Forum | Tue Jun 12 23:25:29 EDT 2001 | chinaren
As you know there will be a lot of residues(such as rosin) left especialy on the peak zone and cooling zone of reflow oven after reflow soldering in a time. who use one kind of effective liquor or effective method to clean the residues ?
Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020
Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
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