Electronics Forum | Tue Oct 30 14:39:41 EST 2001 | markhoch
Has anybody else out there had problems with SMT connectors with plastic locating pins lifting up during the reflow process? We've had several instances with several differant types of SMT connectors lifting up during the reflow process. We've even g
Electronics Forum | Tue Oct 30 19:14:21 EST 2001 | davef
I'll ask you the same questions as this poster ... http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4627&mc=2
Electronics Forum | Tue Oct 30 18:43:31 EST 2001 | mparker
My first thought is board warp. This is something you can't see when the board is in a reflow oven. I see it occasionally going through wave solder. You may need a pallet with hold down clamps for reflow. Try putting a bare board in a baking oven at
Electronics Forum | Thu Sep 16 08:47:39 EDT 2010 | headlad
I extended the pads to help ensure the component locates correctly and to allow for easier re-work should problems occur. I reduced the thermal by 5% but you may want to speak to your fabricator and ask what they require to ensure that the resist is
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Tue Aug 11 08:19:48 EDT 2009 | cyber_wolf
Has anyone located an alternate source for the Fuchs Stabylan oil that Vitronics calls for ? $65 a pint seems a little stiff.
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Thu Jun 07 18:09:21 EDT 2007 | stephan
We noticed unsufficient soldering on some 0805 chips located between pins from a plastic bloc connector . All chips are soldered with 45� angle. Flux quantity , preheating , contact time and PCB quality was checked. Do you know any international stan
Electronics Forum | Thu Apr 29 17:52:33 EDT 2021 | mike_infl
We have an assembly which we are trying to machine pick and place a Mil-Max pin that is .020 dia placed in a .026 hole. The board is .1125 thick. We have to place 106 of these pins. Without going into the challenge of getting proper hole-fill to me
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