Electronics Forum | Fri Sep 18 11:23:32 EDT 2009 | isd_jwendell
I know nothing about Xbox specific rework, but have a lot of experience with PCB repairs. "...maybe think its a bad idea now not knowing what im doing" Don't get discouraged, it's a learning process. If it was that easy everyone would be doing it.
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Thu Dec 23 13:38:25 EST 2004 | clampron
Over The Hill, Sounds like you may have an incorrect height specified on a package causing the tool to slam into the board. The most likely cause is removing a magazine while the machine is running but I too have perfect operators who NEVER do that.
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Wed Jun 27 03:43:24 EDT 2012 | allgood
Very interesting - esp that you have removed the temperature variable by being airconditioned. We defeinitely do not get strikes at 74 but do at 80 - but also we dont start the machine when its 80, that is the afternoon tempertaure on a rare hot day
Electronics Forum | Fri Jul 20 07:09:29 EDT 2007 | chrispy1963
Sr. Tech, youre absolutely correct that the X-Wagon (pancake) motor is the one which will do final positioning when moving to a programmed position. The X Axis motor in back of the machine is used for rapid traverse of the axis. I was thinking more
Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon
Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,
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