Electronics Forum | Sat Jul 31 23:17:48 EDT 2004 | Bryan Sherh
Hi,Please 1.X-ray your board where you found pinholes.perhaps you'll found much voids in your joints,but not only the pinhole.this must be caused by the poor solderability of PCB mostly...or components. 2.Cross-section the pin hole or void in the joi
Electronics Forum | Mon Aug 09 16:37:14 EDT 1999 | John Thorup
| Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, an
Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Wed Jul 21 13:18:19 EDT 2004 | patrickbruneel
Thomas, The first thing I would suggest you to do is identify the type of problem your dealing with �pinhole� or �blowhole� before you can take the appropriate action to correct the problem. A pinhole is a void or cavity caused by non-wettable part
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Wed Jul 23 05:47:53 EDT 2003 | iman
Yo Thanks! right on the money pad, the pinhole occurs mainly in the (fillet's) top-surface central of the whole solder (fillet surface) area. Like you said, large surface area, lowest surface tension. that's a possible cause, that the potential voi
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Mon Jul 21 21:59:08 EDT 2003 | davef
Theory #6 [maybe 3a?]: If you change your paste to a 'non-voiding' paste, your problem will go away. It's the flux in your paste that's killing you. The flux gets trapped in the solder and then releases ejacta that form the volcanic openings in you
Electronics Forum | Wed Jan 16 12:30:38 EST 2008 | davef
As Rob says, blowholes and pinholes are process indicators. Reworking them most likely makes the solder connection less reliable, because it is very difficult to heat the solder connection properly. Shrewd rework-types "paint" solder over these open
