Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Tue Feb 23 11:05:46 EST 2010 | kjs123p
We had this same problem several years ago. The caps and resistors were cracking when we snapped the boards apart. We now use a pizza cutter style depanelizer. A couple of manufacturers that I know of are CAB and Fancort. I hope this helps.
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Tue Nov 15 14:27:25 EST 2005 | Samir Nagheenanajar
We used to affectionately nickname our "roll blade" equipment.... A very technical term.... THE PIZZA CUTTER!
Electronics Forum | Wed Apr 16 12:50:56 EDT 2014 | comatose
We have several, the one everyone likes is a Fancort VPD5-330. We were having trouble with cracked ceramics near the score line with our pizza cutter style depaneler. The linear blade made it go away entirely. Not the cheapest, though.
Electronics Forum | Tue Mar 18 12:38:39 EDT 2008 | fsw
Hi! Can anyone tell me what is the min spacing between PCB edge & land pattern to avoid cracking of components due to mechanical stresses caused while depaneling with cookie/pizza cutter. Thnx!
Electronics Forum | Wed Nov 25 12:33:16 EST 1998 | Scott Snider
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Wed Jan 04 05:11:58 EST 2006 | dougs
I've seen cracked caps due to de-panelling on caps 40mm in from a board edge, if the cap lies on a stress line it can be cracked quite far in, i'd go with the other replies and make sure you use a "pizza cutter" type de-panelling machine for v-scored
Electronics Forum | Tue Feb 28 16:58:39 EST 2006 | PWH
Too fast heating/cooling rate in reflow (look at mfg's spec.). Z "overdrive" on pick and place or chipshooter though unlikely I would say. Depanelization method (bending a scored board to break it is tough on things). Bad PCB design - cap. too clo
