Electronics Forum: poor wetting on bga (Page 1 of 8)

Alternative tin-lead solder pastes to minimize poor wetting on o

Electronics Forum | Fri Mar 23 03:41:19 EDT 2012 | grahamcooper22

try Almit Sn62 HM1 RMA V14L ....its the best no clean lead paste for wetting...I sell it and it has solved wetting problems many times when users have used other pastes

Alternative tin-lead solder pastes to minimize poor wetting on o

Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng

Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a

Alternative tin-lead solder pastes to minimize poor wetting on o

Electronics Forum | Fri Mar 23 10:00:38 EDT 2012 | isd_jwendell

I am a big fan of AIM SnPb solder paste. I currently use NC257-2 (no-clean, 89.5%), and recommend you include it in your evaluations.

No wetting on connector latches

Electronics Forum | Thu Sep 02 09:51:53 EDT 2004 | davef

We see latches from some suppliers that just are not solderable. Usually the nickel plate on the latch is poor, allowing the nickel to corrode, and requiring a more active flux [if you're lucky]. But lots of times, you end-up with partial wetting,

BGA non wetting

Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22

Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It

BGA non wetting

Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22

If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making

fillets on fine pitch parts/poor wetting

Electronics Forum | Thu Nov 07 12:35:38 EST 2002 | slthomas

Sounds like you're talking about the "heel" of the lead not being soldered, in other words, no heel fillet, which IS necessary. That problem, for us, was attributed primarily to poor layout (insufficient length of pad extension to provide room for

BGA non wetting

Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22

Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp

Poor wetting to palladium

Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B

I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi

fillets on fine pitch parts/poor wetting

Electronics Forum | Wed Nov 06 19:03:33 EST 2002 | broncos

If you are certain that reflow process is good, I would suggest starting checking the following: 1. Check to see if leads / pads are contaminated or oxidized. However, this usually results poor solder quality throughout the board. 2. Check the amou

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