Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Sat Apr 10 09:24:44 EDT 2004 | ccl
u are right, Dave, AUS 5 is a LPISM paste. Thanks a lot for the advise and ref. given. rgd ccl
Electronics Forum | Thu Aug 05 16:19:21 EDT 2004 | Kris
All Can someone explain what full body gold is ? Any reference material to read from ? Thx
Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl
thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)
Electronics Forum | Thu Aug 05 18:21:16 EDT 2004 | davef
Well, it could be the beautiful Jill Masterson, as Goldfinger's trusted card advisor Shirley Eaton, who gave new meaning to the phrase "golden girl." Or more mundanely, gold thickness usually ends-up: * Gold fingers (10 to 100 micro-inches) * Selec
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Thu Dec 09 08:29:19 EST 1999 | Charmaine Bode
Excuse my ignorance. Please advise whether it is advisable to pre-bake boards before assembly. Thanks Charmaine
Electronics Forum | Wed May 28 12:31:18 EDT 2003 | larryk
This is our first experience with running embedded flexs. Our board supplier suggested that we prebake our assemblies before placing components. What does everyone else do? Is prebaking normal when a flex is embedded?
