Electronics Forum | Wed Oct 21 08:16:40 EDT 1998 | Andy
| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the fol
Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish
Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1
Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman
I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Wed Aug 04 11:01:46 EDT 2010 | ooskii
I have a question concerning what plating will go into solution during the reflow process. I am soldering a small piece of ceramic (120x180 mils 7 mil thick) onto a flex circuit. I am seeing some fractures that I am sure are being caused by handlin
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef
A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI
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