Electronics Forum | Fri Nov 22 11:31:52 EST 2013 | igorfo
Hi I aa QE on SMT line that produce products for Home introduction. No so long ago we have a problem with soldering of BGA Head on Pillow (root cause mismatching customer requirements and BGA profile spec, suplier change %Ag) and our product affect
Electronics Forum | Mon Nov 25 00:45:35 EST 2013 | igorfo
Thank you for advice, But main concern how to detect the problems with BGA on SMT line, and how I can validate "good" or "bad" profile. PS: SPC said that process Cpk 2, temperature profile in the upper spec limit for TAL and peak temperature.
Electronics Forum | Fri Oct 22 03:23:37 EDT 1999 | Brian
I agree with John, but Manko has also published 'Soldering Handbook for Printed Circuits and Surface Mounting' (van Nostrand Reinhold, a little more practical and less strong on the theory of his classic one, which is beginning to date (1st published
Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi
Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i
Electronics Forum | Sat Jan 15 13:13:33 EST 2000 | Mark Wiegold
Steve, Basically in answer to your question, there is no real set number for defects. Defect rates will vary between products and companies. If my company was running the same product as yourself then there is no reason to suggest that the defect ra
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Thu Aug 22 09:09:42 EDT 2002 | 11878525
Hello Dimitry, EWI has been in the contract manufacturing business for 19 years. We're loacated in the metro Orlando (Florida) area. Currently running 3 fully automated SMT lines with PTH support lines. Would be interested in discussing your requirem
Electronics Forum | Thu May 04 13:16:07 EDT 2023 | tommy_magyar
If I would need to investigate this claim, I would ask the following questions: - was traceability used when this product was manufactured? - was testing mandatory when this specific product was built? - is the test covering the QFP we are talking ab
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