Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Mon Oct 27 12:19:43 EDT 2008 | evtimov
Hello all, can anyone tell me where I can buy front connectors for UIC feeders? Or at least the probe pins. From Universal connectors cost a small fortune. Emil
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
Electronics Forum | Mon Nov 14 02:39:39 EST 2005 | lantech
Hello all! Our test adapter have not a plate, which close test probes. We want to do a plate with through holes for test probes and holes for guiding and centring pins. We want to order a making this one. Adapter is MTS180. Thanks.
Electronics Forum | Sat Jul 29 13:30:17 EDT 2006 | Chunks
Some have a bottom side adaptor plates with pins to make contact to certain areas of your board. The top side may have one or multiple heads that can move the entire area of your board. On each of these haeds is a pin like that from an ICT machine.
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Fri Jun 01 05:46:12 EDT 2012 | vileo72
Hello friends , What is the extent of Probe mark allowed on a assembled board ? Is there any related material on net or standard .Recently we had an issue where the ICT was done and the joints on which the pins were tested had dents on the joints
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
