Electronics Forum: product design (Page 12 of 115)

Encapsulating prior to Potting

Electronics Forum | Wed Feb 25 12:01:15 EST 2015 | jasonnova

Welcome to the world of Contract Manufacturing. Unfortunately there is not an opportunity for redesign. This is a growing customer that we are training to involve us during the design stage to avoid production issues like this. The customer would

Quick Turn Around for an EMS Provider - Brainstorming

Electronics Forum | Thu Jan 15 10:12:15 EST 2009 | jwolvans

What is the shift structure of your shop? If your facility has only one 8 or 9 hour shift per day, then a 3-day turnaround is nearly impossible. However, if you are running multiple shifts that keep the shop alive 24 hours per day, then it is absolut

DowCorning SylGard 160 removal

Electronics Forum | Thu Oct 17 12:01:09 EDT 2013 | pavel_murtishev

Gentlemen, Have no idea how to remove fully polymerized silicone elastomer resides from a particular product. Product housing has not been designed for filling. Having polymerized, elastomer (DowCorning SylGard 160)expands and gets out of filling ho

Immersion Ag

Electronics Forum | Mon May 13 11:17:57 EDT 2002 | genny

I think for our company, the reason we have not yet tried it is two fold. One - we are just barely starting to see a need on a new product under design for a flat finish, so currently we don't use any of the really flat finishes available. Two - Silv

Conformal Coating in New England

Electronics Forum | Fri Jan 13 06:54:12 EST 2006 | pjc

Here's a couple more: Vitek Coating Div., Vitek Research Corp. - Derby, CT - Contact Service Company Company Profile: Parylene Conformal Coating Services With Plasma Surface Treatment To Enhance Adhesion. Electrostatic Powder & Liquid Coating Of Med

Soldering Specification Needed

Electronics Forum | Mon Sep 26 14:05:04 EDT 2011 | scottp

I agree that class III is overkill for most applications and the customer needs to pay for it if that's what they want. It's also true that class III doesn't assure things won't fail. Life expectancy is mostly due to component and material selectio

BGA pad size

Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef

Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn

DFM REPORT

Electronics Forum | Mon Jul 09 20:55:15 EDT 2001 | davef

Very clever posting this thread on the SMTnet Site Support Forum. As the previous poster implied ... WHAT???? Your question is unspecific. In the most basic sense ... Design-For-"X" (DF"X"). The value-added service of instituting "best practice

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK

Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target

Circuitcam reference designators

Electronics Forum | Tue Dec 08 11:18:30 EST 2015 | emeto

Hello all, we are using Circuitcam for all our internal records and programming our production machines. When I auto assign labels for my reference designators, machine will create designators with different sizes(some of them are too small to see i


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