Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX
Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu
Electronics Forum | Mon Aug 07 16:23:34 EDT 2000 | Ramon I Garcia C
Hi!!! Thanks frieds for your advising, I have a MPM UP2000, I'm going to chek the humidity control, too I'll chek the profiles again, this plant it's located close to the beach about 1/2 mile from. However if you know some table to calculate t
Electronics Forum | Tue Jul 11 10:28:02 EDT 2000 | John Thorup
Dave, George I think we're missing something here, or at least I am. While the plastic in question could possibly be dissipative or non generating, I'm wondering how thick such a stencil would be to clear even the lowest profile PTH component? Can w
Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed
It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil
Electronics Forum | Wed May 24 16:47:22 EDT 2000 | Chris McDonald
I have found that if you have a custom carrier with support between pcbs on both SMT reflows (If you palletize) it will eliminate warping. Also Prebaking PCBS with wieght on the top of them helps too. Also look at the cooldown of your oven profile, y
Electronics Forum | Thu Apr 13 07:30:09 EDT 2000 | Christopher Lampron
I agree with Nick. You should check with the manufacturer to determine what type of plating is used on the components and see if the manufacturer has any recomendations on materials that may help. If no exotic materials are used, the culprit is most
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
Electronics Forum | Wed Feb 07 16:14:54 EST 2001 | Antonio
I've recently read a posting here which said that the person was trying to reduce solder balls. One of the things the person had done was to adjust the reflow profile so as to be hotter and longer in the reflow state. Am I wrong here? I thought th
Electronics Forum | Thu Feb 22 12:42:02 EST 2001 | moncav
Dear SMTneter's; I am looking for a few board manufacturers to evaluate a new product. This device is a tooling fixture that conforms to any board profile for support during single or double side printing or placement. It's clean, simple and very r
