Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose
Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Mon Oct 18 11:01:26 EDT 2004 | DenisM
I have had similar problems and my customers have had this too. A two story drop test was made by one of my customers and they found that changing Sn63 solder to Sn62 solder made a significant impact. There is no real downside other than a slightly
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Thu Dec 21 04:27:31 EST 2000 | teohbengee
Need help urgently. Anyone can provide me some information or site on reliability test on PCB assembly like solder joint or anything. Some test like ERSA Test, SHMOO Test, Pull Test, Temperature cycle and humidity Test, vibration Test or any related
Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony
I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where
