Electronics Forum | Fri Oct 11 03:17:52 EDT 2002 | Adam
Guys I was wondering if anybody has some useful advice with regards to achieving 100% solder penetration on one pin of a through hole device which I believe is attached to a ground plane. All other pins on the through hole device are fine, Just this
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Tue Nov 24 19:17:29 EST 2009 | gregoryyork
It could be that the Sn96 has dissolved the Tin rapidly and gone for the Copper. What dwell times are they using with the irons? Probably better off using a Tin Copper alloy for reduced dissolution worth a try Cheers Greg
Electronics Forum | Thu Dec 17 03:45:47 EST 2009 | tod1967
was the wetting test conducted with SN96? Do any Pull or stress testing?
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Fri Nov 11 04:06:46 EST 2005 | arnold
we are manufacturer of molded type transformer. we have a trim and form process and its damage the pins of our units. the TIN insulation was being damage so we decide to immediately solder (wave soldering) the units to avoid oxidation. my question is
Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21
Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem
