Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Wed Oct 06 22:55:14 EDT 2004 | davef
Your customer is correct. Components should not fall a board during a reasonable drop test. A shear test poorly represents a drop test. A drop test represents a drop test very well. If you want to proceed with shear testing, search the fine SMTne
Electronics Forum | Mon Oct 18 11:01:26 EDT 2004 | DenisM
I have had similar problems and my customers have had this too. A two story drop test was made by one of my customers and they found that changing Sn63 solder to Sn62 solder made a significant impact. There is no real downside other than a slightly
Electronics Forum | Wed Mar 30 14:16:42 EST 2005 | chon
Davef That's why I mentioned that this was the "Closest" written procedure I've found related to this type of tests.
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Mon Mar 28 14:57:46 EST 2005 | chon
So far I've been working with a xtal. I've been placing this on a board and the part was falling from the board. We found residues on leads and notified vendor as contamination, after that 100% of our production has been verified with a perpendicular
Electronics Forum | Tue Mar 29 09:02:13 EST 2005 | Indy
chon, we do a similar kind of perpendicular test, but have not found any kind of specifications to determine if the force is good eoungh. Since you mentioned that 6 pound-inch was enough for your application, could you provide some insight on how
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Tue Mar 22 07:39:05 EST 2005 | davef
There is no standard. This is a relative test. If you wish to do tests of this kind, we suggest to pay attention to the following points: * Shear strength of soft solder depends on the deformation speed applied. The faster the material is deformed t
