Electronics Forum | Fri Feb 20 12:36:36 EST 2009 | melectmark
Try Rapid- tool www.rapidtool.com
Electronics Forum | shenzhenwayken |
Tue Dec 24 02:09:46 EST 2019
Electronics Forum | Tue May 21 21:36:10 EDT 2002 | rwilliams
I'd like to hear from anyone regarding the use of Data-PAQ's new Rapid Oven Set-Up software. This looks ideal for our low volume, high mix environment. Anyone having any comments good or bad would certainly be appreciated. Thanks, Ron
Electronics Forum | Fri Oct 27 09:10:34 EDT 2000 | jackofalltrades
We are very happy with Datum Dynamics (www.datumdynamics.com), good qualitiy and rapid turn around. They do our tooling plates, reflow pallets, selective wave pallets for a large number of varied customers.
Electronics Forum | Wed Jun 20 16:09:21 EDT 2001 | Gil Zweig
Clearly, x-ray inspection should not become a bottleneck in the production process. The concept of "signature" identification is to rapidly qualify a BGA attachment as acceptable or suspicious. If suspicious, the board is taken off line for further s
Electronics Forum | Wed Sep 05 09:57:09 EDT 2001 | Glenbrook
Glenbrook Technologies provides rapid and competent x-ray inspection services with knowledgeable interpretation of the x-ray images.
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Tue Apr 16 11:13:22 EDT 2002 | gzweig
In response to questions on BGA Process Requirements and X-ray Inspection please request pdf publication : "Rapid and Effective X-ray Inspection of BGA using Siganture Identification" from : gzweig@glenbrooktech.com
Electronics Forum | Fri Jun 14 14:29:22 EDT 2002 | davef
Russ makes good points. Search the archives for: * Links to rework machine profiles. * Discussion on people causing corner shorts on their BGA, when heating them too rapidly, making the corners to curl like potato [potatoe?] chips.
Electronics Forum | Thu Mar 10 15:04:40 EST 2005 | pmd
Rapid heating of solder caused solder underneath surface to expand and become pressurized. Check to see if power cycles on and off during warm up. A slower rate of of climb should help.
