Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Sat Jan 13 17:19:15 EST 2007 | aj
Hi all, What length of time is recommended for the "soak stage"? aj...
Electronics Forum | Mon Jun 03 13:10:35 EDT 2019 | gregoryyork
We recommend a ramp soak spike profile for HASL finish, so everything gets nicely heated during reflow, we soak around 180C and peak at 245- 250C and don't have any issues as long as the levelling isn't too peaky.
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Tue Jun 03 15:18:33 EDT 2008 | jdengler
As chunks says use the paste manufacturers recommendation. Our paste manufacturer has recommendations on both �straight ramp� and �soak� for our paste. We prefer the �straight ramp� on most boards due to the increased production it enables. There a
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Tue Jun 03 14:28:49 EDT 2008 | cdsullivan
Good Afternoon, I know that most of the answers I get for this are going to be along the lines of "it's up to you" and I realize that. But, I was wondering what the most common type of profile that is used in your shop and why? Is it the older "S
Electronics Forum | Wed Feb 14 08:15:08 EST 2007 | CK the Flip
I agree with Rob that voids are often times paste-dependent, and it's all about the type of flux that's used. The cause of the voids, as you all know, is outgassing of flux which has nowhere to go with BGA's. Some paste mfgrs. will recommend going
Electronics Forum | Thu Nov 16 10:15:12 EST 2006 | SWAG
Does anyone have new info on their ROHS PCB delam. problems? We ran two profiles (different from ours) per supplier recommendations with no improvement on this problem. These profiles included a plateau or soak at 190 deg. C for 20 seconds and a sl
Electronics Forum | Mon Feb 26 20:05:09 EST 2024 | alexv
Leaded solder is liquidus at 183C, 220C is max. Sounds to me your boards might be contaminated or the plating is poor and allows oxidation. Without seeing the boards or profile, I recommend you slow down your oven for a longer soak, to allow the acti
