Electronics Forum: reflow inverters (Page 1 of 4)

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

Re: Double Reflow

Electronics Forum | Tue Dec 28 15:35:21 EST 1999 | Mike Naddra

Edmund, An 0603 component should not fall from the board durring an inverted reflow pass, provided that: Your land geometries are correct for the package type (Start with SM 782 guidlines)- as surface tension of the liquidous solder is what holds

LGA Rework

Electronics Forum | Mon Nov 26 11:33:25 EST 2012 | pbarton

We print paste directly on to the parts then invert, place & reflow using a dedicated I/R rework station. Works well for us on a wide variety of footprints.

Heat guns and component damage

Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN

Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul

SMT packages that can solder inverted?

Electronics Forum | Thu Aug 28 16:13:06 EDT 2003 | Dan Gosselin

Thanks everyone for your help. I have since found a good article I am downloading of of the SMTA website. Dan Title : EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Author : Mulugeta Abtew Author Company

Double Sided Reflow - Components on Bottom Side

Electronics Forum | Mon Oct 04 11:28:46 EDT 1999 | Mark D.

Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha

Double Sided Reflow - Components on Bottom Side

Electronics Forum | Mon Oct 04 11:23:55 EDT 1999 | Mark D.

Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha

SMT and TH board carrier

Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park

Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav

Epoxy for holding large inductors

Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman

We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als

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