Electronics Forum | Wed Jun 19 01:07:32 EDT 2019 | relaycz
Drop of glue should prevent module from moving, but is not really a solution. What about pad design? Are pads on PCB themselves much larger then the ones on the module?
Electronics Forum | Wed Jun 19 17:44:38 EDT 2019 | slthomas
Does the part have a ground/thermal pad underneath or are all terminations on the perimeter?
Electronics Forum | Mon Jun 24 11:17:33 EDT 2019 | tey422
I believe you have to log in at the SMTNET.net directly in order to attach an image file.
Electronics Forum | Wed Jun 19 02:42:26 EDT 2019 | relaycz
In my opinion, fault lies in printing or reflow. With printing - it's either too much solder paste or bad print, though I would assume that would be caught. With reflow, it could be that ramp up rate is too high.
Electronics Forum | Wed Jun 19 11:41:42 EDT 2019 | tey422
Here is a link of an article regarding the SMD rotation during reflow issue, you may find it useful. http://www.circuitnet.com/experts/86914.html
Electronics Forum | Fri Jun 21 02:11:27 EDT 2019 | alanyang
Many aspects cause such problem, stencil windows and thickness, thermal pad and crowded PTH vias on PCB, the castellated pad size and pcb pad size. Do you have picture for reference?
Electronics Forum | Mon Jun 24 04:34:49 EDT 2019 | SMTA-David
Yes, I have images but how do I upload them to the forum? I am new here
Electronics Forum | Tue Jun 18 23:24:05 EDT 2019 | SMTA-David
Hi, I have a SMD radio module that has castellated Pads along one edge of the module. The pick and place machine appears to place them very well but when the boards come out of the reflow oven then up to 20% of them have either rotated a few degrees
Electronics Forum | Mon Jun 24 10:19:23 EDT 2019 | slthomas
I have not added images in quite some time but the "Attachments" feature below the window where you type your post will steer you through it. You just have to have the image hosted someplace that you can point to. Just for
Electronics Forum | Thu Jun 20 23:28:15 EDT 2019 | SMTA-David
How can I upload image to this forum? I can show you the pad layout. I am thinking maybe too much solder. I used 0.16mm thick stencil but notice many us 0.12mm thickness. Also, cream layer is 100% of pad surface, I know for fine pitch parts it is r
