Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Wed Feb 21 15:29:34 EST 2007 | wavemasterlarry
I here alot of guys at my place talking about cold spots in the oven. You may want to check for them in yours.
Electronics Forum | Fri Jan 13 06:43:20 EST 2006 | cyber_wolf
How would you like to have this guy evaluate your reflow profile? It was in response to an auditor who require someone they had monitor temperature in both Fahrenheit and Celcius. What a geek Don't put him on the spot. That is not a good thing to
Electronics Forum | Wed Jan 14 08:28:15 EST 1998 | Allison
Contact your solder paste manufacturer and get the reflow profile recommended for that particular paste. Then, duplicate that reflow profile on your oven. You will need to use thermocouples. You may have to tweak this profile a little. | We use no
Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Thu Mar 17 12:51:39 EST 2005 | Slow Ride
How much more? A couple degrees? That would be normal from one board to another, depending if the t-coupls are in the exact same spot etc. What type oven? IR ovens can be affected by colors.
