Electronics Forum: reflow profile soak time (Page 1 of 94)

Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong

Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter

Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold

Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Hybrid reflow profile

Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck

Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time

reflow profile development

Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson

First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y

reflow profile

Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi

Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th

Reflow time

Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks

Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach

simple doubt about reflow profile

Electronics Forum | Tue Feb 13 15:56:16 EST 2007 | darby

Campos, This is a direct reply I recieved from Indium, (thanks to Rich Brooks), in late 2004 regarding SMQ230. I have followed these guidelines with good results using ENIG finish. Same also applies to Indium 5.1 apply to both alloys (SAC 387 and 305

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 13:16:35 EST 2007 | CK the Flip Guy

Looks good at first glance. Couple of questions, though: Time Above _____. Fill in the blank. Is Liquidous 183C (Tin-Lead) or 217C to 220C (Lead Free)? The "soak" of 150-190, at 0.6*C per second ramp up looks good, weather it's lead or lead-free

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