Electronics Forum | Thu Jul 20 16:04:22 EDT 2000 | Bob Willis
Tin/silver/copper is the alloy I have done most with and it would seem that it will be the alloy of choice if you look at the people doing the work. There are still some issues of fillet lifting which I have seen on PIHR soldering and the same in wav
Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato
I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for
Electronics Forum | Tue Jan 23 16:22:01 EST 2007 | asir
I'm looking for a PbF solder paste with similar characteristic as the 63/37Pb alloy. What alloy composition would you recommend?
Electronics Forum | Tue Jan 23 19:27:28 EST 2007 | asir
which characteristics? An alloy with similar melting points, wetting, shear force, reliabilities, etc. Indium has an article about 77.2Sn/20.0In/2.8Ag, but was wondering is there any other out there.
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Fri May 21 11:59:24 EDT 1999 | John Eramo
Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked very
Electronics Forum | Wed Jan 17 18:42:49 EST 2007 | Richard
I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.
Electronics Forum | Thu Jan 18 07:30:13 EST 2007 | realchunks
It could be the blowers in cooling section of the oven. Try turning them off. It could be the belt is not level.
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Thu Jan 18 08:37:10 EST 2007 | CL,
"solder tends to pool on the short side of the substrate" Does the short side of the substrate have any significant difference in thermal mass? if so, try slowing the belt (within reason) or increasing temps (within reason) to better equalize therma
