Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Wed Apr 18 06:18:53 EDT 2007 | pavel_murtishev
Good afternoon, Huh. My sympathy. We have the same issue. Check this: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11637&mc=3 BR, Pavel
Electronics Forum | Thu Apr 05 07:02:22 EDT 2007 | pavel_murtishev
Good afternoon, Thanks for input AR. Fortunately, supplier can offer us nickel barrier alternative. I will do exactly as you did. BR, Pavel
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Thu Apr 19 16:54:32 EDT 2007 | flipit
I don't suggest using Pd/Ag or Ag/Pd terminated components unless you are forced to use them. You often see a line of demarcation that suggests a poorly wetted solder joint. I have had bad experiences with Pd/Ag terminated capacitors. Even when so
Electronics Forum | Wed Aug 29 11:07:39 EDT 2007 | mikecollier
I am being asked to perform the same evaluation now with a Au/Pd termination varistor. We currently use a Pb/Sn process with an RMA flux. The manufacturer of the device recommends going to a 2% silver paste. What is the intended advantage with 2%
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
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