Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Tue Jan 23 19:27:28 EST 2007 | asir
which characteristics? An alloy with similar melting points, wetting, shear force, reliabilities, etc. Indium has an article about 77.2Sn/20.0In/2.8Ag, but was wondering is there any other out there.
Electronics Forum | Fri May 21 11:59:24 EDT 1999 | John Eramo
Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked very
Electronics Forum | Wed Jan 17 18:42:49 EST 2007 | Richard
I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.
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