Electronics Forum: risk analysis (Page 1 of 2)

wave solder machine

Electronics Forum | Mon May 16 18:03:30 EDT 2005 | davef

Key Issue: Will this machine solder your boards? You never know until you solder one. Any other avenues of analysis involve substantial risk. Flux Selection * High or low solids * VOC or VOC-free Solder Alloy * If using lead-free, avoid stainles

NASA-UA report update

Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel

Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda

SMT Solder paste and wave flux evaluation

Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld

I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider

Counterbore raw board

Electronics Forum | Thu Aug 17 17:36:08 EDT 2006 | slthomas

I don't have any data (haven't tried this), but it doesn't take much thought to see that determining the risks associated with simultaneously applying compressive and rotational forces to the end of the barrel, not to mention chewing up the copper, i

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 15:37:31 EDT 2008 | scottp

At the risk of painting with too broad a brush: QEs are like seagulls: fly in, make lots of noise, crap all over things, then fly away. Back to the knob turning vs. analysis debate. Part of it may be different industries. We're in the high reliab

Changing a wave over to lead free

Electronics Forum | Thu May 18 16:10:18 EDT 2006 | adlsmt

We did a tin bath on ours but it was provided for free by Nihon Superior so that is a no-brainer. It was better than taking a risk of having to dump the pot. If you cant get a free tin bath, then you should probably go ahead and fill it half way or s

Re: Dark Pad / Gold Embrittlement?

Electronics Forum | Wed Jul 26 10:57:16 EDT 2000 | Steve Schrader

Doug, We've suffered through similar frustrations. One thing we found that might be of some help is uur supplier, unbeknownst to us, was outsourcing their immersion gold. Their supplier apparently lost control of their process for a period of a fe

Re: Catastrophic failure of solid tantalum smt caps

Electronics Forum | Fri Apr 02 02:01:24 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Has anyone heard of a problem with catastrophic failure of | | | large value (200uF) solid tantulum capacitors that have been | | | exsposed to high humdity. | | | | | I suppose that with water moisture seep in the capacitor, the risk is ver

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette

Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl

dendritic growth

Electronics Forum | Tue Dec 14 09:32:59 EST 2004 | patrickbruneel

Hi Paul, One thing I can tell you for sure "lead free" is not going to solve your problem, because spectrum analysis have shown that dendrites at there final stage always consists of pure tin. The higher the tin content the higher the risk for dead

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