Electronics Forum | Wed Mar 03 11:30:18 EST 1999 | dave reese
Are square pads more difficult to wavesolder than round pads? I am referring to a through hole board.
Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY
| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su
Electronics Forum | Thu Mar 19 12:22:54 EDT 2009 | mhjohnso
While investigating a routing study for a new bga device, I found the vendor used round 20 mil pads on 0402 decoupling caps.This allows fitting the caps between break out vias on their 1mm pitch BGA. Round pad gives about 8 mils diagonally from pin t
Electronics Forum | Fri May 07 05:47:44 EDT 1999 | Charles Stringer
This is not strictly a surface mount query but any input welcome I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last two p
Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
Electronics Forum | Mon Jul 31 20:34:58 EDT 2017 | zsoden
Hi all, it has been a bit of a delay but I've finally had a chance to do some further investigation on this. First off, we spend some time to clean the solder bath using Kester Solder Saver and scooped out a lot of crap. We then added about 5kg of
Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov
Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t
Electronics Forum | Wed Nov 05 17:36:12 EST 2003 | Stephen
Make sure that the side of the square is the diameter of the pad, That is that the circle is inside the square not that the square is inside the circle. normally the aperatures are smaller than the pad to get gasketing. In this case the idea is to
