Electronics Forum | Tue Sep 25 19:26:39 EDT 2012 | caurbach
So, I just learned that alpaca isn't just a cousin of the llama, it's also a Cu/Ni alloy (imitation silver). Creeped me out at first... When you say "poor filling and no solder", are you referring to wetting problems? Do you have any photos you co
Electronics Forum | Thu Jul 20 12:21:05 EDT 2000 | Dave F
Bob: Some people suggest different lead-free solder formulations for wave, reflow, and hand soldering. * What are your thoughts on this? * What are the factors that contribute to using different lead-free solder formulations for wave, reflow, and
Electronics Forum | Thu Dec 29 09:20:30 EST 2005 | Cmiller
We have tested SN100C and SAC305 in our selective solder machine (Ersa Versaflow). We wanted to test both alloys in the selective first because the investment in filling the pots is minimal. In our initial tests the SN100C alloy appears to be the bes
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech
Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra
Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef
Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties
Electronics Forum | Mon Nov 27 17:44:10 EST 2000 | Dave F
Gawd. Sure FR-4 will meet those conditions. Tg [check the fine SMTnet Archives for discussion on Tg] of FR-4 is 130�F or so. Consider: * Is the delT between Tg and the upper operating [or storage] temperature acceptable for your application? * D
| 1 |
winsouce.jpg)
