Electronics Forum | Fri Oct 25 08:42:55 EDT 2024 | linux
Bottom side first, use same temp setting both sides.
Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.
Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Sat Oct 26 10:08:31 EDT 2024 | madisreivik
I would (and actually I do :) use 2 different pastes SAC for "simple" side LMPA for "populated" side LMPA has much lower peak temp, so SAC does not remelt and as a result, no glue etc are needed. Yesterday did a board, one side - some 0805 comps a
Electronics Forum | Thu Jun 23 14:13:52 EDT 2005 | Frank
Luckily I haven't needed to do very many bottom side BGA placements. But I have also heard of trying to use a higher temp solder for bottom side only and your normal solder for the top side. This way the bottom side solder doesn't get hot enough to
Electronics Forum | Thu Oct 24 17:34:38 EDT 2024 | duchoang
You should build the bottom side first. The other side has connectors, if you build first, that would be hard for printing solderpaste for the second side. No problem with the BGA if you use rails in oven. Do not send the boards into oven directly on
Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman
Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an
Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Fri Oct 25 10:20:00 EDT 2024 | pawantanwar
Reflow bottom side first, reduce heat slightly for second reflow.
Electronics Forum | Wed Apr 26 06:43:21 EDT 2000 | Sal
Guys We currently produce a number of PCB's which are reflowed on the top side and glued on the bottom side, and the current process is to build the top side and reflow then glue and cure, is this approach correct ? or should we be curing then reflow
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