Electronics Forum | Mon Apr 23 11:58:42 EDT 2001 | CAL
I personally like Universals GSM and the Siemens F series for placement machines and companies. Both have great laboratorys set up for Flip Chip processing.Both Also have industry leading experts on staff. Machine info: can they do tacky flux dispen
Electronics Forum | Mon Sep 20 17:36:46 EDT 1999 | Dave F
| | | Hi all, | | | | | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. | | | | | | We are producing VGA cards and mother boards for PC's all components to be wave so
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Fri Feb 22 15:56:34 EST 2013 | davef
I don't know, what you have, but I just got back from the IPC APEX show and I'll make several points: * One take away about 'nano ...' is that it means different things to different people. For instance, in stencil printing: ** DEK uses Aculon and it
Electronics Forum | Mon Apr 26 16:06:32 EDT 1999 | Chrys Shea
Hey - remember the evaluation of VOC-Free fluxes that I promised a couple of months ago? well, I finally scrounged up the time to remove the propreitary (board name and number) info from the report. So it's ready. I posted it in the SMTnet library
Electronics Forum | Mon Apr 26 21:29:34 EDT 1999 | Dave F
| Hey - remember the evaluation of VOC-Free fluxes that I promised a couple of months ago? well, I finally scrounged up the time to remove the propreitary (board name and number) info from the report. So it's ready. I posted it in the SMTnet libra
Electronics Forum | Wed Jul 29 20:53:44 EDT 1998 | Dave F
| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on ho
Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
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