Electronics Forum: silicon and on and solder and joints (Page 1 of 2)

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris

Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 12:08:17 EDT 1999 | C.K.

| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE

| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n

silicone conformal coat and electrical contacts

Electronics Forum | Tue Jan 30 20:38:32 EST 2007 | davef

NASA Internal Advisory: NASA-Issued Return to Flight Wristbands Contaminated with Silicone [snip] 10. PROBLEM DESCRIPTION: Recently we have been made aware of a silicone problem associated with the "Return to Flight" wristbands. These wristbands are

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 15:27:00 EDT 1999 | Tony

| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an

Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Sun Jun 20 16:45:48 EDT 1999 | Chrys Shea

I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), and

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 12:57:10 EDT 1999 | Earl Moon

| | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something),

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