Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Fri Jun 02 22:46:21 EDT 2006 | mika
Is this the new Xbox 360 You are talking about? So the "modchip" doesn't work? Hmm... Can You please tell us what the purpose of the dissolution of the epoxy on the BGA You would like to do? /
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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