Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Wed Sep 25 05:08:33 EDT 2002 | msimkin
Gregg, We had a similar problem with our 0603 leds. They were being placed bang on, however, during the reflow, they twisted, fell sideways etc. We played with our profile, played with the paste volume & land pattern design, and only had a small impr
Electronics Forum | Sat Dec 04 18:55:38 EST 2004 | Grant
Hi, Yes, all you really need to do is boil the fluid while suspending the PCB above the vapor, so it's quite easy. However I would recommend against dropping the board direct into the vapor cloud, as that would be a very fast warm up, while letting
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar
Flason SMT News: http://www.flason-smt.com/new/6-Things-to-Check-Before-Submitting-Your-PCB-Design-for-Manufacturing.html http://www.flason-smt.com/new/about-wave-soldering-machine-tin-pot.html http://www.flason-smt.com/new/Advantages-of-Design-for-
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
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