Electronics Forum | Thu Mar 13 09:23:26 EST 2003 | jrloudenjr
What types of systems/procedures are normally used or followed to allow for scrap percentages typically from a 43,000cph placement machine.
Electronics Forum | Thu Mar 13 14:51:23 EST 2003 | juan_ruiz
A good standard could be 99.7% of Pick up reliability in terms of machine performance, but you should take care of the cost of the parts that you are scraping.
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Mar 19 07:24:38 EST 1999 | John
| | | | Hi folks, | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc
| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet
Electronics Forum | Fri Jun 14 13:47:21 EDT 2013 | rway
Chances are this is not a component failure. First, these are passive components with passive testing on the ICT. He may have guarding issues, but more information is required as has been stated. Are all capacitors with the same P/N failing in dif
Electronics Forum | Thu Mar 18 11:07:45 EDT 2010 | mun4o
hi, lately I have problem with smd leds.After reflow 2-4% of leds are broken.I think , that reason is bad storage of components, because in our stock the tape with leds have not Moisture Barrier Bags.My question is ,how you storage components, which
Electronics Forum | Fri Jun 14 12:00:10 EDT 2013 | rgduval
Is this a new assembly/new test fixture/program? Or is this an existing assembly that is suddenly exhibiting this failure? Capacitors measured in circuit will not necessarily measure their correct values. Active components in circuit will be affec
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