Electronics Forum: smd distance (Page 1 of 2)

Wave soldering : pin to SMD distance

Electronics Forum | Thu Jun 07 18:09:21 EDT 2007 | stephan

We noticed unsufficient soldering on some 0805 chips located between pins from a plastic bloc connector . All chips are soldered with 45� angle. Flux quantity , preheating , contact time and PCB quality was checked. Do you know any international stan

Wave soldering : pin to SMD distance

Electronics Forum | Fri Jun 08 07:45:58 EDT 2007 | davef

There is no standard for the spacing of components, nor should there be. We have a difficult time picturing your 0805 at a 45* to the wave and the safe pin, but we'd guess this spacing needs to be 10 thou.

Selective soldering

Electronics Forum | Fri May 30 07:00:41 EDT 2008 | radizouani

What is the distance between smd components that should be held in consideration due to selective soldering ( size soldering nozzle) ? What is your advise due to the purshase a selective soldering machine.

SMD land patterns design for wave soldering

Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno

I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 08:33:14 EDT 2005 | pjc

Is not a problem, I've done it. Be sure the insertion tooling and cut&clinch tooling are set to proper distances from the board. If proper, no deflection of PCBA should be observered during AI. Obviously, your AI Operator must be more careful with PC

Stacking chips

Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan

I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint

SMD Adhesives Gluing Process

Electronics Forum | Fri Sep 18 00:39:23 EDT 2009 | rohitfast

Hi Davef & Mikes, Thanks for the response. I am agree with both of your point. If the component bosy will be fall in Coductive or dissipative range, there are chances of shorting. Other thing in ESDS:2020 8.3 para is saying to keep away all the insul

Re: Aperture sizes for printing SMD adhesive

Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F

| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the

Re: Soldering on a Ground Plane

Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.

Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i

Unsoldered Component

Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen

Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if

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